Reference Spec.No.JENF243A-0018AJ-01 P1/11

MURATA MFG.CO.,LTD.

村田 系列原厂授权一级代理分销经销通路供应商 光与电子，电话

Reference Only

Chip Ferrite Bead BLM15□□□□□SN1□ REFERENCE SPECIFICATION

1.Scope

This reference specification applies to Chip Ferrite Bead BLM15_SN series.

2.Part Numbering

(ex.) BL M 15 AG 100 S N 1 D

(1) (2) (3) (4) (5) (6) (7) (8) (9)

(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz

(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)

3.Rating

Customer

Part Number

MURATA

Part Number

Impedance ()

(at 100MHz,Under Standard

Testing Condition) Rated Current

(mA)

DC Resistance

( max.)

Initial Remark

Values

Values

After

Testing Typical

BLM15AG100SN1D 5～15 10 1000 0.025 0.05

For

general

use

BLM15AG100SN1B

BLM15AG700SN1D 40～100 70 600 0.15 0.20 BLM15AG700SN1B

BLM15AG121SN1D 120±25% 120 550 0.19 0.29 BLM15AG121SN1B

BLM15AG221SN1D 220±25% 220 450 0.29 0.39 BLM15AG221SN1B

BLM15AG601SN1D 600±25% 600 300 0.52 0.62 BLM15AG601SN1B

BLM15AG102SN1D 1000±25% 1000 300 0.65 0.75

BLM15AG102SN1B

BLM15AX100SN1D 5～15 10 1740 0.015 0.025 BLM15AX100SN1B

BLM15AX300SN1D 30±25％ 30 1100 0.06 0.11 BLM15AX300SN1B

BLM15AX700SN1D 70±25％ 70 780 0.10 0.15 BLM15AX700SN1B

BLM15AX121SN1D 120±25％ 120 700 0.13 0.18 BLM15AX121SN1B

BLM15AX221SN1D 220±25％ 220 600 0.18 0.23 BLM15AX221SN1B

BLM15AX601SN1D 600±25% 600 500 0.34 0.39 BLM15AX601SN1B

BLM15AX102SN1D 1000±25% 1000 350 0.49 0.54 BLM15AX102SN1B

BLM15BA050SN1D 5±25% 5 300 0.10 0.15

For

high speed

signal line

BLM15BA050SN1B

BLM15BB050SN1D 5±25% 5 500 0.08 0.15 BLM15BB050SN1B

BLM15BA100SN1D 10±25% 10 300 0.20 0.25 BLM15BA100SN1B

BLM15BB100SN1D 10±25% 10 300 0.10 0.15 BLM15BB100SN1B

BLM15BA220SN1D 22±25% 22 300 0.30 0.35 BLM15BA220SN1B

BLM15BB220SN1D 22±25% 22 300 0.20 0.30 BLM15BB220SN1B

BLM15BA330SN1D 33±25% 33 300 0.40 0.45 BLM15BA330SN1B

邮箱 谢谢惠顾

Reference Spec.No.JENF243A-0018AJ-01 P2/11

MURATA MFG.CO.,LTD.

Reference Only

Customer

Part Number

MURATA

Part Number

Impedance ()

(at 100MHz,Under Standard

Testing Condition)

(Note)

Rated Current

(mA)

DC Resistance

( max.)

Initial Remark

Values

Values

After

Testing Typical

BLM15BA470SN1D 47±25% 47 200 0.60 0.65

For

high speed

signal line

BLM15BA470SN1B

BLM15BB470SN1D 47±25% 47 300 0.35 0.45 BLM15BB470SN1B

BLM15BA750SN1D 75±25% 75 200 0.80 0.85 BLM15BA750SN1B

BLM15BB750SN1D 75±25% 75 300 0.40 0.50 BLM15BB750SN1B

BLM15BD750SN1D 75±25% 75 300 0.20 0.30 BLM15BD750SN1B

BLM15BB121SN1D 120±25% 120 300 0.55 0.65 BLM15BB121SN1B

BLM15BD121SN1D 120±25% 120 300 0.30 0.4 BLM15BD121SN1B

BLM15BB221SN1D 220±25% 220 200 0.80 0.90 BLM15BB221SN1B

BLM15BC121SN1D 120±25％ 120 350 0.45 0.50 BLM15BC121SN1B

BLM15BD221SN1D 220±25% 220 300 0.40 0.50 BLM15BD221SN1B

BLM15BD471SN1D 470±25% 470 200 0.60 0.70 BLM15BD471SN1B

BLM15BC241SN1D 240±25％ 240 250 0.70 0.75 BLM15BC241SN1B

BLM15BD601SN1D 600±25% 600 200 0.65 0.75 BLM15BD601SN1B

BLM15BD102SN1D 1000±25% 1000 200 0.90 1.0 BLM15BD102SN1B

BLM15BD152SN1D 1500±25% 1500 190 1.0 1.1 BLM15BD152SN1B

BLM15BD182SN1D 1800±25% 1800 100 1.4 1.5

BLM15BD182SN1B

BLM15BX750SN1D 75±25% 75 600 0.15 0.20 BLM15BX750SN1B

BLM15BX121SN1D 120±25% 120 600 0.17 0.22 BLM15BX121SN1B

BLM15BX221SN1D 220±25% 220 450 0.27 0.32 BLM15BX221SN1B

BLM15BX471SN1D 470±25% 470 350 0.41 0.46 BLM15BX471SN1B

BLM15BX601SN1D 600±25% 600 350 0.46 0.51 BLM15BX601SN1B

BLM15BX102SN1D 1000±25% 1000 300 0.65 0.75 BLM15BX102SN1B

BLM15BX182SN1D 1800±25% 1800 250 0.90 1.0 BLM15BX182SN1B

Reference Spec.No.JENF243A-0018AJ-01 P3/11

MURATA MFG.CO.,LTD.

Reference Only

Customer

Part Number

MURATA

Part Number

Impedance ()

(at 100MHz,Under Standard

Testing Condition)

(Note)

Rated Current

(mA)

DC Resistance

( max.)

Initial Remark

Values

Values

After

Testing Typical at 85℃ at 125℃

BLM15PG100SN1D 5～15 10 1000 0.025 0.05

For DC

power line

BLM15PG100SN1B

BLM15PD300SN1D 30±25% 30 2200*1 1400*1 0.035 0.05 BLM15PD300SN1B

BLM15PD600SN1D 60±25% 60 1700*1 1100*1 0.06 0.075 BLM15PD600SN1B

BLM15PD800SN1D 80±25% 80 1500*1 1000*1 0.07 0.085 BLM15PD800SN1B

BLM15PD121SN1D 120±25% 120 1300*1 900*1 0.09 0.105 BLM15PD121SN1B

BLM15PX330SN1D 33±25％ 33 3000*1 1700*1 0.022 0.037 BLM15PX330SN1B

BLM15PX600SN1D 60±25％ 60 2500*1 1400*1 0.032 0.047 BLM15PX600SN1B

BLM15PX800SN1D 80±25％ 80 2300*1 1300*1 0.038 0.053 BLM15PX800SN1B

BLM15PX121SN1D 120±25％ 120 2000*1 1100*1 0.055 0.070 BLM15PX121SN1B

BLM15PX181SN1D 180±25％ 180 1500*1 800*1 0.090 0.105 BLM15PX181SN1B

BLM15PX221SN1D 220±25％ 220 1400*1 800*1 0.10 0.115 BLM15PX221SN1B

BLM15PX331SN1D 330±25％ 330 1200*1 700*1 0.15 0.165 BLM15PX331SN1B

BLM15PX471SN1D 470±25％ 470 1000*1 600*1 0.20 0.22 BLM15PX471SN1B

BLM15PX601SN1D 600±25％ 600 900*1 500*1 0.23 0.25 BLM15PX601SN1B

BLM15KD200SN1D 20±25% 20 3800*1 2350*1 0.011 0.016 BLM15KD200SN1B

BLM15KD300SN1D 30±25% 30 3100*1 1900*1 0.017 0.022 BLM15KD300SN1B

BLM15KD121SN1D 120±25% 120 1500*1 930*1 0.070 0.085 BLM15KD121SN1B

■Operating Temperature : -55°C to +125°C ■Storage Temperature : -55°C to +125°C

(Note) As for the Rated current marked with *1,

Rated Current is derated as right figure

depending on the operating temperature.

Operating Temperature (°C)

85 125

Rated Current (A)

0

at 85°C

Rated current

at 125°C

Rated current

Reference Spec.No.JENF243A-0018AJ-01 P4/11

MURATA MFG.CO.,LTD.

Reference Only

4.Style and Dimensions

■ Equivalent Circuit

■ Unit Mass(Typical value)

0.001g

5.Marking

No marking.

6.Standard Testing Conditions

 Unless otherwise specified   In case of doubt 

Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

7.Specifications

7-1.Electrical Performance

No. Item Specification Test Method

7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz

Measuring Equipment : KEYSIGHT4291A or the equivalent

Test Fixture : KEYSIGHT16192A or the equivalent

7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter

*Except resistance of the Substrate and Wire

7-2.Mechanical Performance

No. Item Specification Test Method

7-2-1 Appearance

And

Dimensions

Meet item 4. Visual Inspection and measured with Slide Calipers.

7-2-2 Bonding

Strength

Meet Table 1.

Table 1

It shall be soldered on the substrate.

Applying Force(F) : 5N

Applying Time : 5s±1s

Applying Direction: Parallel to the substrate.

7-2-3 Bending

Strength

It shall be soldered on the substrate.

Substrate: Glass-epoxy 100mm40mm0.8mm

Deflection : 2.0mm

Speed of Applying Force : 0.5mm/s

Keeping Time : 30s

: Electrode

1.0±0.05 0.5±0.05

0.25±0.1

0.5±0.05

(in mm)

Resistance element becomes ( ) dominant at high frequencies.

Appearance No damage

Impedance

Change

(at 100MHz)

Within ±30%

DC

Resistance Meet item 3.

R0.5

Ｆ

Substrate

Ｆ

Side view

45mm

R340 F

Deflection

45mm Product

Pressure jig

Reference Spec.No.JENF243A-0018AJ-01 P5/11

MURATA MFG.CO.,LTD.

Reference Only

No. Item Specification Test Method

7-2-4 Vibration Meet Table 1. It shall be soldered on the substrate.

Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 h)

7-2-5 Resistance

to Soldering

Heat

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270°C±5°C

Immersion Time : 10s±0.5s

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room conditionfor 48h±4h.

7-2-6 Drop Products shall be no failure

after tested.

It shall be dropped on concrete or steel board.

Method : free fall

Height : 75cm

Attitude from which the product is dropped : 3 direction

The number of times : 3 times for each direction(Total 9 times)

7ｰ2-7 Solderability The electrodes shall be at

least 95% covered with new

solder coating.

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240°C±5°C

Immersion Time : 3s±1s

Immersion and emersion rates : 25mm/s

7-3.Environmental Performance

It shall be soldered on the substrate.

No. Item Specification Test Method

7-3-1 Temperature

Cycle

Meet Table 1. 1 cycle :

1 step : -55 °C(+0 °C,-3 °C) / 30min±3min

2 step : Ordinary temp. / 10min to 15min

3 step : +125 °C(+3 °C,-0 °C) / 30min±3min

4 step : Ordinary temp. / 10min to 15min

Total of 100 cycles

Then measured after exposure in the room condition for

48h±4h.

7-3-2 Humidity Temperature : 40°C±2°C

Humidity : 90%RH to 95%RH

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for

48h±4h.

7-3-3 Heat Life Meet Table 2.

Table 2

Temperature : 125°C±3°C

Applying Current : Rated Current(at 125°C)

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for

48h±4h.

7-3-4 Cold

Resistance

Meet Table 1. Temperature : -55±2°C

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for

48h±4h.

Appearance No damage

Impedance

Change

(at 100MHz)

Within ±30%

(for BLM15PD

Within ±40%)

DC

Resistance Meet item 3.

Reference Spec.No.JENF243A-0018AJ-01 P6/11

MURATA MFG.CO.,LTD.

Reference Only

8.Specification of Packaging

8-1.Appearance and Dimensions (8mm-wide paper tape)

(1) Taping

Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed

by top tape and bottom tape.

(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.

(3) Spliced point:The base tape and top tape have no spliced point

(4) Cavity:There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept.

8-2.Tape Strength

(1)Pull Strength

Top tape 5N min. Bottom tape

(2)Peeling off force of Cover tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off:300mm/min

8-3.Taping Condition

(1)Standard quantity per reel

Quantity per 180mm reel 10000 pcs. / reel

(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.

(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape

for more than 5 pitch.

(4)Marking for reel

The following items shall be marked on a label and the label is stuck on the reel.

(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2) , Quantity, etc)

1) « Expression of Inspection No. » □□ OOOO 

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking » ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

(5)Outside package

These reels shall be packed in the corrugated cardboard package and the following items shall be marked

on a label and the label is sticked on the box.

(Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking(2) ,Quantity, etc)

F 165 to 180 degree Top tape

Bottom tape Base tape

0.65(Typ.) 0.8max.

1.15(Typ.)

(in mm)

2.0±0.05

2.0±0.05 4.0±0.1 1.5+0.1

-0 1.75±0.1 3.5±0.05 8.0±0.3

Direction of Feed

Reference Spec.No.JENF243A-0018AJ-01 P7/11

MURATA MFG.CO.,LTD.

Reference Only

(6)Dimensions of reel and taping(leader-tape, trailer-tape)

(in mm)

8-4. Specification of Outer Case

Outer Case Dimensions

(mm) Standard Reel Quantity in Outer Case

(Reel) W D H

186 186 93 5

Above Outer Case size is typical. It depends on a quantity of an order.

9. ！ Caution

9-1. Surge current

Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause

a critical failure, such as an open circuit, burnout caused by excessive temperature rise.

Please contact us in advance in case of applying the surge current.

9-2.Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment

(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment

(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment

(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above

10.Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

10-1.Land pattern designing

Standard land dimensions (Reflow soldering)

< For BLM15 series (except BLM15P□, BLM15AX, BLM15KD type) >

(in mm)

Empty tape

190 min.

Leader

Trailer

2.0±0.5

13.0±0.2

21.0±0.8

180

60

9.0

13.0±1.4

+1

-0

+0

-3

Direction of feed

210 min.

160 min.

Top tape

+1

-0

Label

W

D

Label

H

1.2～1.4

Solder Resist

Pattern

0.5

0.4

Chip Ferrite Bead

Reference Spec.No.JENF243A-0018AJ-01 P8/11

MURATA MFG.CO.,LTD.

Reference Only

< For BLM15P□, BLM15AX, BLM15KD type >

Rated

Current

(A)

a b c

Land pad thickness

and dimension d

18µm 35µm 70µm

1.5 Max

0.4 1.2 to 1.4 0.5

0.5 0.5 0.5

2.2 Max 1.2 0.7 0.5

3.0 Max 2.4 1.2 0.5

(in mm)

The excessive heat by land pads may cause

deterioration at joint of products with substrate.

10-2.Soldering Conditions

Products can be applied to reflow soldering.

(1) Flux,Solder

Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Solder Use Sn-3.0Ag-0.5Cu solder

Standard thickness of solder paste : 100 µm to 200 m

(2) Soldering conditions

Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited

to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference

is limited to 100℃ max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

(3) Soldering profile

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 2 times

10-3. Reworking with soldering iron

Pre-heating: 150°C, 1 min Soldering iron output: 80W max.

Tip temperature: 350°C max.  Tip diameter:φ3mm max.

Soldering time : 3(+1,-0) seconds.  Times : 2times max.

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the ferrite material due to the thermal shock.

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

ｄ

Chip Ferrite Bead

Solder Resist

Pattern

ｃ

ａ

ｂ

Reference Spec.No.JENF243A-0018AJ-01 P9/11

MURATA MFG.CO.,LTD.

Reference Only

10-4.Solder Volume

Solder shall be used not to be exceed as shown below.

1/3T≦t≦T

(T:Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

10-5.Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

<Products direction>

Products shall be located in the sideways

direction (Length:ab) to the mechanical

stress.

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from the board separation surface. A > C

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

10-6.Mounting density

Add special attention to radiating heat of products when mounting the inductor near the products with heating.

The excessive heat by other products may cause deterioration at joint of this product with substrate.

Recommendable

Upper Limit

t

〈Poor example〉 〈Good example〉

b

a

Perforation

Slit

A

B

C

D

Screw Hole Recommended

Reference Spec.No.JENF243A-0018AJ-01 P10/11

MURATA MFG.CO.,LTD.

Reference Only

10-7.Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.

(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases

and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

10-8.Resin coating

The impedance value may change and/or it may affect on the product's performance due to high cure-stress of

resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to

use, please make the reliability evaluation with the product mounted in your application set.

10-9.Cleaning Conditions

Products shall be cleaned on the following conditions.

(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)

(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.

(3)Cleaner

1.Alternative cleaner

Isopropyl alcohol (IPA)

2.Aqueous agent

PINE ALPHA ST-100S

(4)There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5)Other cleaning

Please contact us.

10-10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

10-11.Storage Conditions

(1)Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2)Storage conditions

Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity : 15% to 85% relative humidity

No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization

of electrode, resulting in poor solderability.

 Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

Products should be stored under the airtight packaged condition.

(3)Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

Reference Spec.No.JENF243A-0018AJ-01 P11/11

MURATA MFG.CO.,LTD.

Reference Only

11. ! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.