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The 21st China Semiconductor Packaging and Testing Technology &
Market Annual Conference 2023
Agenda
Conference Overview
DATE TIME EVENT VENUE
Oct. 24th 08:00-18:00 Special Exhibition Set-up Kunshan Ballroom 2-3, 3F
Oct. 25th
10:00-21:00 Registration Lobby, 1F
15:00-17:30 Council Meeting (Members only) International Hall 3, 7F
15:00-21:00 Exhibition Set-up Kunshan Ballroom 2-3, 3F
Oct. 26th
09:00-18:10 Theme Forum Kunshan Ballroom 1, 3F
09:00-18:00 Exhibition Kunshan Ballroom 2-3, 3F
18:15-20:30 Welcome Dinner 6F, Fengle Jun
Oct. 27th
09:00-16:55
Session I: Innovation and Opportunities in
Packaging Testing and Process Equipment International Hall 1, 7F
09:00-17:05
Session Ⅱ: Innovation and Cooperation of
Key Advanced Packaging Materials International Hall 2, 7F
09:00-17:05
Session III: Automotive Electronic Chips
and Power Compound Semiconductor
Packaging and Testing Technology
International Hall 3, 7F
Session IV: Advanced Packaging and
Testing Technology International Hall 3, 7F
13:30-17:00 Session V: Henkel Forum Exhibition Hall 2, 8F
09:00-17:00 Exhibition Kunshan Ballroom 2-3, 3F
※This agenda is for referencethe final will change accordingly.
19
Theme Forum
Oct. 26th 09:00-18:10 Venue: Kunshan Ballroom 1, 3F
Moderator:Dongmei XU, Secretary-General of CSIA, Packaging & Testing Branch
Opening Ceremony
09:00-09:30 Welcome Addresses
Shengli XIAO, Honorary Chairman of CSIA, Packaging & Testing Branch
Yuanchao LIU, Vice Chairman of CSIA
Wei ZHOU, Member of the Standing Committee of the Suzhou Municipal Committee,
Jiangsu Province. Secretary of the Kunshan Municipal Party Committee
Tianchun YE, Secretary General of ICIA, Academician of IEAS
Shaojun WEI, Professor of Tsinghua University, Academician of the International
Eurasian Academy of Sciences, Vice President of CSIA
09:30-09:50 Current Status and Outlook of China Semiconductor Packaging and Testing Industry
Aimo XIAO, Rotating Chairman of CSIA, Packaging & Testing Branch
09:50-10:10 Several New Advances in the Third Generation Semiconductor
Yue HAO, Academician of CAS Member,Director of Information Science Department
of National Natural Science Foundation of China
10:10-10:30 Networking Break
Keynote Speech
10:30-10:45 Building an Advanced Semiconductor Manufacturing Big Data System
Zhinong LIU, EVP of Unisoc (Shanghai) Technologies Co., Ltd
10:45-11:00 Laser Application and Challenges in Semiconductor Advanced
Heterogeneous Packaging
Desmond Hor, VP of Wuxi Lead Group, VGM of Wuxi Lead Laser Technology Co.,
Ltd.
11:00-11:15
High Reliability Microsystem Integration Technology for High Computing Power and
High Bandwidth Applications
Zongguang YU, Doctor, China Key System & Integrated Circuit Co., Ltd. Chief
Scientist of CETC/Rotating Chairman, Packaging & Testing Branch of CSIA
11:15-11:30 2.5D&3D Advanced Packaging Etching Technology Challenges and Solutions
Weitao Zhang, Beijing NAURA Microelectronics Equipment Co., Ltd.
The Product Director,BU ETCH I
20
11:30-11:45 Chiplet Packaging in IC Design: A Game-Changer
Ed Gu, MetaX Integrated Circuits (Shanghai) Co., Ltd., Director of Package & Chip
Supply Chain
11:45-12:00 Advanced packaging will help China chip make significant breakthrough
Dennies Ma, Huatian Technology (Kunshan) Electronics Co., Ltd, President of Research
Institute
12:00-13:30 Buffet Lunch
Moderator: Xia REN, Vice Secretary-General of CSIA, Packaging & Testing Branch
13:30-13:50 Latest Developments, Challenges and Opportunities of Chiplet technologies
Hong XIE, TongFu Microelectronics VP, General Manager of the Corporate
Engineering Center
13:50-14:10 Application of Optical Microscopy in Semiconductor Manufacturing
Xiao Ma, Shenzhen Glint Vision Co., Ltd
14:10-14:30 Chiplet integration trend in advanced Fan-out Packaging
David Wang, CRD, SPIL
14:30-14:50 Chip-Package-PCB Co-Design
David Wu, CEO of Shanghai RedEDA Co., Ltd.
14:50-15:10 AI-and-vision-fusion Solution and Application in Defect Inspection
Duojie Kuai, MEGAROBO Technologies, Technical Scientist
15:10-15:30 Networking Break
15:30-15:50 Diversified cost-optimized solutions for automotive electronics test handler
Guangman Lin, Shenzhen shenkeda Semiconductor Technology Co., Ltd
General Manager
15:50-16:10
Advanced inspection & measurement technologies help improving the yield during chip
manufacturing
Changli WU, R&D Director of Matrixtime Robotics Co., Ltd.
16:10-16:30 Dry Ice Cleaning Technology Introduction and Case Studies
Steven Su, Sales Director-China, Cold Jet Dry Ice Equipment (Shanghai) Co., Ltd.
21
16:30-16:50 Semiconductor dicing process and precision dispensing process to share
Yun ZHOU, Shenzhen Tensun Precision Equipment Co., Ltd.,
Semiconductor Precision Dicing BU Director
16:50-17:10 Adv. PKG Integration for Smart Computing Application
Yaojian LIN, JCET Group, VP
17:10-17:30 《Wafer Laser Etching Scheme Based on Semiconductor 3D Stacking Technology》
Chang CHEN, Shenzhen Han’s Semiconductor Equipment & Technology Co., LTD
17:30-17:50 Practice and thinking of innovation of advanced packaging technology
Daquan Yu, CEO of Xiamen Sky semiconductor Co., Ltd.
17:50-18:10
New Theory and New Method for the Interfacial Study of Electronic Packaging
Materials
Gi Xue, Nanjing University
18:15-20:30 Welcome Dinner
22
Session I: Innovation and Opportunities in Packaging/Testing & Process
Equipment
Oct.27th 09:00-16:55 Venue: International Hall 1, 7F
Moderator: Hua WU, Vice Secretary-General of China Semiconductor Industry Association,
Packaging & Testing Branch
09:00-09:25 Advanced Grinding Technology for A New Future
Jinlong Gao, JCA & Vice general manager
09:25-09:50 Failure Analysis of Electronics Products Subjected to HALT
Chiente Wu,ESPEC Environmental Equipment(Shanghai)Co., LTD., HALT/HASS
Applications Senior Engineer
09:50-10:15 Advances in Heterogenous Integration & C2W Hybrid Bonder
Eric, Chi WANG, SUZHOU ACCURACY ASSEMBLY AUTOMATION Co., Ltd,
Founder/Board Chairman
10:15-10:30 Networking Break
10:30-10:55 Applications of Bonding and Debonding in Semiconductor Package
Dr. YuCheng ChangSUZHOU IWISEETEC CO., LTD
10:55-11:20 YAMAHA 1 STOP SMART SOLUTION for Sintering
Eric LEE, Manager, Taiwan Office, PFA Corporation, YAMAHA Robotics Holding
11:20-11:45 Battery Management Systems (BMS) Device Testing and Trends for Automotive
Aik-Moh Ng, Product Manager, Teradyne
11:45-12:10 Fluxless TCB for Ultra-fine Pitch and Large Die Applications
Eric Zhao, Kulicke & Soffa Pte. Ltd., Regional Product Marketing Manager, Advance
Packaging
12:10-13:30 Buffet Lunch
Moderator: Dennies Ma, Huatian Technology (Kunshan) Electronics Co., Ltd, President of
Research Institute
13:30-13:55 SMEE Advanced Packaging Lithography Stepper Helps the Development of Chiplet
Technology
Douglas Huang, Vice GM of Shanghai Micro Electronics Equipment (Group) CO.,
LTD
13:55-14:20 Opportunities and Challenges for Memory Die Bonder
Xiaolong OuyangVice President, R&D Center of DongGuan Attach Point Intelligent
Equipment Co., Ltd
14:20-14:45 Study of 2.5D/3D Heterogeneous Integration Based on Advanced Packaging
Chengqian WANG, Deputy Director of China Key System & Integrated Circuit CO.,
LTD, Micro-Manufacture Department
23
14:45-15:10 Trends and Prospects of Heterogeneous Integrated Microsystem Technology Based on
Micro-Nano Interconnection
Leida CHEN,Vice General manager of Natural Integration Advanced Semiconductor
Technology Co.,Ltd.
15:10-15:25 Networking Break
15:25-15:50 Challenges and Applications of Advanced Packaging Technology
Jun LI, Technical Expert of Sky Chip Interconnection Technology Co., Ltd.
15:50-16:15 Advanced Die bonder Equipment: Empowering the Iteration and Innovation of
Advanced Packaging Technology in the Post Moore Era
Jason SONG, Vice president of Capcon Limited
16:15-16:55 Application of ISO26262 Vehicle Functional Safety System in the Automotive
Electronics Industry
Zongwei ZHANG, Head, Functional Safety Certification, Bureau Veritas China
END
24
Session Ⅱ: Innovation and Cooperation of Key Advanced packaging Materials
Oct.27th 09:00-17:05 Venue: International Hall 2, 7F
Moderator: Guohua ZHANG, Vice Secretary-General of CSIA, Packaging & Testing Branch
09:00-09:25 The opportunities and challenges of Advanced Packaging substrate
Xin GU, CEO of Zhongshan CCSC Co., LTD
09:25-09:50 Application of Curing Kinetics in Epoxy Molding Compound
LIU XIANG,R&D Manager of DOITECH Semiconductor Advanced Material Co.,
Ltd
09:50-10:15 New Progress in Copper Alloys for Semiconductor Lead Frames
Jason Zhang,Director, Technical Marketing Department of Boway Alloy Plate and
Strip Co., Ltd
10:15-10:30 Networking Break
10:30-10:55 Advanced Packaging Material Solutions Empowering Sustainable Development
Jing Zhang, Doctor, Head of Shanghai Innovation Center, Heraeus Electronics China
10:55-11:20 Current Development Status and Outlook of PhotoSensitive Polyimide Materials (PSPI)
in Domestic Market
Qingzhou Cui, R&D Director for Photoresist Materials, Jinan Shengquan New
Materials LTD.
11:20-11:45 Research Progress of Epoxy Molding Compound in Zhongke KEHUA
Shanxue Wang, Deputy General Manager, Jiangsu Zhongke KEHUA New Materials
Co., Ltd
12:00-13:30 Buffet Lunch
Moderator:Junfeng CHANG, Secretary General of SZSIA
13:30-13:55 The Challenge and Solution for Advanced Package Material
Tommy Zhang, Weldtone Technology Co., Ltd. Technical Service Director
13:55-14:20 Application of New Soldering Thermal Interface Materials in Advanced Packages
Leo HU, Indium Corporation, Senior Area Technical Manager - East China
14:20-14:45 ACCESS Advanced IC-Substrate Solutions
Simon CHAN, CEO of Zhuhai ACCESS Semiconductor Co., Ltd.
14:45-15:10 Introduction of semiconductor assembly material from Cluster Technology Co., Ltd.
Douhaku Kotaro, Cluster Technology Co., Ltd.
15:10-15:25 Networking Break
15:25-15:50 Power Semiconductor Packaging Paste Solutions
Norman WANG, PacTite Electronic Materials Co., Ltd. Chief Sales Officer
15:50-16:15 High reliability QFN packaging lead frame solution
25
Sidney Zhang, Ningbo Kangqiang Electronics Co., Ltd., Deputy General Manager of
ELF Division
16:15-16:40 Technical Development of Domestic Epoxy Molding Compound
Wei Tan, R&D Manager of Jiangsu HHCK Advanced Materials Co., Ltd
16:40-17:05 New material solutions for silicon carbide module packaging
Sean Chen, Deputy Senior Manager, Marketing & Sales of Sumitomo Bakelite
(Suzhou) Co., Ltd.
END
26
Session III: Automotive Electronic Chips and Power Compound
Semiconductor Packaging and Testing Technology
Session IV: Advanced Packaging and Testing Technology
Time: Oct.27th 09:00-17:05 Venue: International Hall 3, 7F
Moderator: Weidong LIU, Vice Secretary-General of CSIA, Packaging & Testing Branch
09:00-09:25 Technology and Quality control for Automotive Electronic Packaging
Xiaowei Guo, Technical Director of Huatian Technology Xi’an Co., Ltd
09:25-09:50
Domestic intelligent manufacturing software to assist in the digital and intelligent
upgrading of semiconductor packaging and testing factories
Wayne MA, Vice-general Manager, Semiconductor BG, GETECH
09:50-10:15
ZEISS microscopy solutions for advanced packaging failure analysis and process
optimization
Chengliang Huang,Carl Zeiss (Shanghai) Co., Ltd., BD Manager
10:15-10:30 Networking Break
10:30-10:55 Power semiconductor trends and test solutions of Advantest CREA
Junlin Wang, Advantest China, Business Development & Center of Expertise,Asia
10:55-11:20 Key Packaging Technologies for Silicon Carbide Power Module
Jet SUN, Director, Basic Semiconductor (Wuxi)Co., Ltd
11:20-11:45
Silicon Carbide Power Device Testing: from Development to Mass Production, from
Wafer to Application
Yuan GAO, Global Power Technology Co., Ltd., Inc., Director of Application and Test
Center
11:45-12:10 Characteristic package design and technology
Jue Wang,Sichuan Suining Lippxin Microelectronics CO.,LTD Marketing & RD
manager
12:10-13:30 Buffet Lunch
Moderator: Weidong LIU, Vice Secretary-General of CSIA, Packaging & Testing Branch
13:30-13:55
Application and Development Trends of Advanced Packaging in the Automotive
Industry
Johnson Zhang, JCET Auto BU, Director
13:55-14:20 Development of Advanced Packaging Process and Solution to Bubble Problem
Woody Jones, General Manager, Elead Technology Co., Ltd.
14:20-14:45 CIM Solution in Semiconductor Packing、Test & Assembly Service
Anita Gu, Product Development Director of Semiconductor Division of Nanjing
DigiHua Intelligent Systems Co., Ltd.
27
14:45-15:10 Automotive Semiconductor Packaging – Market & Technology Dynamics
Jianmin LI, Packaging RnD Director, Amkor Assembly & Test (Shanghai) co. Ltd.
15:10-15:25 Networking Break
15:25-15:50 ThermoFisher Scientific Solution for Advanced Packaging R&D and Failure Analysis
Vincent Yang, ThermoFisher Scientific, Sales Development Manager
15:50-16:15 Beyond Moore: Chiplets and Advanced Heterogeneous Integration
Cheng-Tar Terry Wu, Director, Business Development Team, AVP,
Samsung Electronics
16:15-16:40 Development of IC Heterogeneous Integration Packaging Technology
Daping YAO, Jiangsu CAS Microelectronics Integration Technology Co., Ltd.,
Chairman & CEO
16:40-17:05 Moore Elite SiP Solution
MooreElite
END
28
Session V: Henkel Forum
Time: Oct. 27th 13:30-17:00 Venue: Exhibition hall 2, 8F
12:00-13:30 Lunch, registration
13:30-13:45 Opening Addresses
13:45-14:15 Henkel Automobile Semiconductor Materials Solution
14:15-14:45 Henkel High Thermal Conductivity Chip Bonding Solution
14:45-15:15 Henkel Material Solutions for Advanced Packaging Applications
15:15-15:45 Tea Break
15:45-16:15 Henkel Chip Adhesive Film Solution
16:15-17:00 Exchange and collection of souvenir materials
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